SIGNAL INTEGRITY TEST APPARATUS AND METHOD FOR TESTING SIGNAL INTEGRITY OF ELECTRONIC PRODUCT

摘要

In a method for testing signal integrity of an electronic product using a signal integrity test apparatus, each electronic component of the electronic product includes a test label that identifies the electronic component. The signal integrity test apparatus includes a host computer, a robot device, an oscilloscope, a camera device, and a probe. The host computer is installed with a signal integrity test system that controls the signal integrity test apparatus to test signal integrity of the electronic product. The robot device includes a first robot arm and a second robot arm. The first robot arm controls the camera device to capture an image of the test label coupled to each electronic component. The second robot arm controls the probe to touch each electronic component. The oscilloscope measures voltage signals outputted from the electronic components to generate a signal integrity report of the electronic product.

主权项

1. A signal integrity test apparatus comprising:
a robot device comprising a first robot arm and a second robot arm; a host computer being connected to an electronic product comprising a plurality of electronic components, the host computer comprising:
at least one processor, anda storage device storing a computer-readable program comprising instructions that, when executed by the at least one processor, causes the at least one processor to:
control the first robot arm to move a camera device to an electronic component to be tested of the electronic product, and control the camera device to capture an image of a test label coupled to the electronic component;identify a VCC point and a GND point of the electronic component from the image of the test label, and determine an insertion direction of the probe and a touch stress when the probe touches the electronic component;control the second robot arm to move a probe to the electronic component according to the insertion direction of the probe;control the probe to touch the VCC point and the GND point of the electronic component according to the touch stress;obtain a positive voltage signal from the VCC point when the probe touches the VCC point, and obtain a negative voltage signal from the GND point when the probe touches the GND point;control an oscilloscope to measure signal integrity of the positive voltage signal and the negative voltage signal; andgenerate a signal integrity report of the electronic product based on the measured results of all electronic components of the electronic product.