发明名称 LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE
摘要 A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.
申请公布号 US2015035001(A1) 申请公布日期 2015.02.05
申请号 US201414339911 申请日期 2014.07.24
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 YAMAZAKI Shunpei;JINBO Yasuhiro;EGUCHI Shingo
分类号 H01L33/52;H01L51/00;H01L51/52 主分类号 H01L33/52
代理机构 代理人
主权项 1. A light-emitting device comprising: a first flexible substrate; a second flexible substrate; an element layer between the first flexible substrate and the second flexible substrate; a first bonding layer between the first flexible substrate and the element layer; and a second bonding layer between the second flexible substrate and the element layer, wherein the element layer comprises a light-emitting element, wherein the first bonding layer and the second bonding layer extend beyond an end portion of the element layer and are in contact with each other, and wherein the first flexible substrate and the second flexible substrate extend beyond the end portion of the element layer, an end portion of the first bonding layer, and an end portion of the second bonding layer and are in contact with each other.
地址 Atsugi-shi JP