| 摘要 |
This sputtering apparatus is provided with: an electrode (310), which has a holding section (311) for holding a target (50), and which applies a potential to the target (50) via the holding section (311); a first magnet (331) and a second magnet (332), which are disposed by being spaced apart from each other in the direction along a substrate disposing surface (SS) on which a substrate is to be disposed, said first magnet and second magnet being disposed to sandwich a space (SP) between the substrate disposing surface (SS) and the holding section (311); and a shield (340) that is disposed at a position which is between the first magnet (331) and the second magnet (332), and between the substrate disposing surface (SS) and the holding section (311). The target (50) includes a flat board-like first portion (51) to be disposed between the first magnet (331) and the space (SP), and a flat board-like second portion (52) that is to be disposed between the second magnet (332) and the space (SP), and the first portion (51) and the second portion (52) are disposed in parallel to each other so as to sandwich the space (SP) therebetween. |
