| 摘要 |
Some embodiments include semiconductor constructions. The constructions have an electrically conductive post extending through a semiconductor die. The post has an upper surface above a backside surface of the die, and has a sidewall surface extending between the backside surface and the upper surface. A photosensitive material is over the backside surface and along the sidewall surface. Electrically conductive material is directly against the upper surface of the post. The electrically conductive material is configured as a cap over the post. The cap has an edge that extends laterally outwardly beyond the post and encircles the post. An entirety of the edge is directly over the photosensitive material. Some embodiments include methods of forming semiconductor constructions having photosensitive material adjacent through-wafer interconnects, and having electrically conductive material caps over and directly against upper surfaces of the interconnects and directly against an upper surface of the photosensitive material. |
