发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having good electrical characteristics; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: forming a first conductive film on an oxide semiconductor film; forming a second conductive film on the first conductive film; selectively removing a part of the second conductive film; forming a third conductive film by covering the second conductive film; and performing a washing treatment after selectively removing a part of the first conductive film and third conductive film. A copper-containing material is used for the second conductive film. A residual copper element is removed by the washing treatment.</p> |
申请公布号 |
JP2015026830(A) |
申请公布日期 |
2015.02.05 |
申请号 |
JP20140126434 |
申请日期 |
2014.06.19 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SHIMA YUKINORI;KAMINAGA MASAMI;NAKAZAWA YASUTAKA;HIZUKA JUNICHI;YAMAZAKI SHUNPEI |
分类号 |
H01L21/336;H01L21/28;H01L21/304;H01L29/417;H01L29/786 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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