发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device having good electrical characteristics; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: forming a first conductive film on an oxide semiconductor film; forming a second conductive film on the first conductive film; selectively removing a part of the second conductive film; forming a third conductive film by covering the second conductive film; and performing a washing treatment after selectively removing a part of the first conductive film and third conductive film. A copper-containing material is used for the second conductive film. A residual copper element is removed by the washing treatment.</p>
申请公布号 JP2015026830(A) 申请公布日期 2015.02.05
申请号 JP20140126434 申请日期 2014.06.19
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 SHIMA YUKINORI;KAMINAGA MASAMI;NAKAZAWA YASUTAKA;HIZUKA JUNICHI;YAMAZAKI SHUNPEI
分类号 H01L21/336;H01L21/28;H01L21/304;H01L29/417;H01L29/786 主分类号 H01L21/336
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