发明名称 |
METHOD FOR MEASURING RESISTIVITY OF SILICON WAFER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for measuring the resistivity of a silicon wafer by which the resistivity of a high-resistivity silicon wafer having a resistivity of 2000Ωcm or more can be measured accurately without causing variation or fluctuation.SOLUTION: A method for measuring a resistivity of silicon wafer comprises the steps of: removing, by means of a water-free treatment, a surface layer on a surface of the silicon wafer to be measured by a thickness of no less than 10 nm when a least two hours elapses after execution of a donor killer treatment on a high-resistivity silicon wafer; and bringing an electrode needle into contact with the surface to be measured with the surface layer removed to measure the resistivity.</p> |
申请公布号 |
JP2015026755(A) |
申请公布日期 |
2015.02.05 |
申请号 |
JP20130156293 |
申请日期 |
2013.07.29 |
申请人 |
GLOBALWAFERS JAPAN CO LTD |
发明人 |
KIMURA TAMAMI;SAITO HIROYUKI |
分类号 |
H01L21/66;G01N27/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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