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发明名称
ヒートシンク
摘要
<p>【課題】ヒートシンクに取り付けられる、極端に小さい半導体の場合においてもヒートシンク重量を増加させないような構造のヒートシンクを提供する。【解決手段】ヒートシンク片同士を接続する際、隣り合う２つのヒートシンク間に銅等の熱伝導率のよい熱拡散材料を挟み込む。【選択図】図５</p>
申请公布号
JP3195778(U)
申请公布日期
2015.02.05
申请号
JP20140003235U
申请日期
2014.06.19
申请人
发明人
分类号
H01L23/36;H01L23/373;H05K7/20
主分类号
H01L23/36
代理机构
代理人
主权项
地址
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