EMI COMPARTMENT SHIELDING STRUCTURE AND FABRICATING METHOD THEREOF

摘要

A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch.

主权项

1. An electronic package module having integrated EMI compartment shielding structure, comprising:
a substrate having mounting surface, comprising a ground pad exposedly arranged thereon; at least one electronic element disposed on the mounting surface; an encapsulating member disposed on the mounting surface, covering the ground pad and encapsulating at least one of the electronic element, the encapsulating member having at least one peripheral surface,
wherein a trench is disposed in the encapsulating member to define at least two package compartments, the trench at least partially exposes the ground pad,wherein the terminal portions of the trench is arranged within the encapsulating member proximal to yet without compromising the peripheral surface thereof;wherein at least one notch is disposed into the encapsulating member from the peripheral surface thereof corresponding to the location of the terminal portions of the trench; a compartment structure disposed in the trench covering the trench surface,
wherein the compartment structure electrically connects the ground pad,wherein the notch exposes the lateral surface of the compartment structure across the thickness of the encapsulating member; and a conformal shield disposed on the encapsulating member,
wherein the conformal shield electrically connects the compartment structure through the notch.