SEMICONDUCTOR DEVICE WITH COMBINED PASSIVE DEVICE ON CHIP BACK SIDE

摘要

Semiconductor chips are described that combine a semiconductor device and a capacitor onto a single substrate such that the semiconductor device and the capacitor are electrically isolated from each other. In one example, a semiconductor chip includes a substrate having a first side and a second side, wherein the second side is opposite the first side. The semiconductor chip further includes a semiconductor device formed on the first side of the substrate and an electrically insulating layer formed on at least a portion of the second side of the substrate. The semiconductor chip further includes a capacitor device formed on at least a portion of the electrically insulating layer on the second side of the substrate, wherein the capacitor device is electrically insulated from the semiconductor device.

主权项

1. A semiconductor chip comprising:
a substrate including a first side and a second side, wherein the second side is opposite the first side; a semiconductor device formed on the first side of the substrate; an electrically insulating layer formed on at least a portion of the second side of the substrate; and a passive device formed on at least a portion of the electrically insulating layer on the second side of the substrate, wherein the passive device is electrically insulated from the semiconductor device.