| 摘要 |
Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and a cleaning unit. The reflow treating unit includes a process chamber having a treating space therein, a support member disposed within the treating space, an exhaust member connected to a top surface of the process chamber to exhaust a fluid within the treating space, and an absorption prevention plate spaced apart from an upper portion of the support member, the absorption prevention plate having a flat plate shape with a predetermined thickness. |
| 主权项 |
1. An apparatus treating apparatus comprising:
a load port on which a carrier accommodating a substrate is seated; a substrate treating module comprising one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate; and a substrate transfer module disposed between the load port and the substrate treating module, wherein the substrate transfer module comprises a transfer robot transferring the substrate among the load port, the substrate treating module, and a cleaning unit, wherein the reflow treating unit comprises: a process chamber having a treating space therein; a support member disposed within the treating space; an exhaust member connected to a top surface of the process chamber to exhaust a fluid within the treating space; and an absorption prevention plate spaced apart from an upper portion of the support member, the absorption prevention plate having a flat plate shape with a predetermined thickness. |
