ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

摘要

Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

主权项

1. A method, comprising:
connecting an integrated circuit chip to a substrate,
said substrate having a first surface and a second surface and electromagnetic interference (EMI) absorbing material on at least a portion of at least one of said first surface and said second surface of said substrate; electrically connecting said integrated circuit chip to said substrate; connecting said substrate to a printed circuit board; and connecting a lid to said integrated circuit chip, said substrate, and said printed circuit board, a periphery of said lid comprising a side skirt, said side skirt circumscribing said integrated circuit chip and said substrate, said connecting of said lid comprising:
depositing EMI absorbing material on said printed circuit board; andembedding a portion of said side skirt in said EMI absorbing material.