发明名称 OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE
摘要 Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.
申请公布号 US2015033550(A1) 申请公布日期 2015.02.05
申请号 US201414519981 申请日期 2014.10.21
申请人 Lenovo (Singapore) Pte. Ltd. 发明人 BORAAS MICHAEL A.;KAMATH VINOD;MILLER MICHAEL S.;STEINKE MARK E.;WAKIL JAMIL A.
分类号 B23P15/26 主分类号 B23P15/26
代理机构 代理人
主权项
地址 Singapore SG