| 摘要 |
<p>The present invention relates to a patterned plastic ball grid array package and, more particularly, to a patterned plastic ball grid array package capable of improving the reliability of the package by decreasing a running speed or preventing mechanical damage by distributing the concentration of deformation energy applied to a solder ball in the plastic ball grid array (PBGA) package. To achieve the purpose, the present invention provides the patterned plastic ball grid array package which includes a semiconductor chip and a molding part for fixing the semiconductor chip which are formed on the upper side of a substrate while combining the substrate on the upper side of the substrate by using the solder ball. A deformation preventing part is formed on the upper side of the molding part. The deformation preventing part is located on the edge of the semiconductor chip.</p> |
