| 摘要 |
PROBLEM TO BE SOLVED: To suppress a decrease in film deposition speed due to sticking of sputter particles on a protection member.SOLUTION: A sputtering device includes: a chamber which is evacuated to product a vacuum; a plasma generating gas introduction part; a target holding part; a substrate holding part which holds a substrate as an object of film deposition opposite a target held by the target holding part; a plasma generation part which generates high-frequency induction coupling plasma of plasma generating gas in the chamber; a power source which applies a sputter voltage to the target; a dielectric-made protection member which protects the plasma generation part against exposure of the plasma generation part to the plasma generated in the chamber; and one or more sticking suppression members which are put over the protection member in a removable manner so as to cover a main surface, protruding into the chamber, of the protection member respectively, and suppress sputter particles sputtered from the garget from sticking on the protection member. A film is deposited on the substrate by sputtering the target. |
