发明名称 |
OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical module which effectively improves the luminous efficiency of a light emitting chip and improves defects, i.e. reception defects of a light receiving chip, and to provide a manufacturing method of the optical module.SOLUTION: An optical module includes: a substrate 20; a light emitting chip 30; a light receiving chip 40; package members 50; and a lid member 60. A light emitting zone 22 and a light receiving zone 24 are defined in the substrate 20. The light emitting chip 30 is provided at the light emitting zone 22 of the substrate 20. The light receiving chip 40 is provided at the light receiving zone 24 of the substrate 20. The package members 50 respectively cover the light emitting chip 30 and the light receiving chip 40, and a first lens part 52 and a second lens part 54 are formed at the package members 50. The lid member 60 is fastened onto the substrate 20 and the package members 50. |
申请公布号 |
JP2015026799(A) |
申请公布日期 |
2015.02.05 |
申请号 |
JP20130225342 |
申请日期 |
2013.10.30 |
申请人 |
LINGSEN PRECISION INDUSTRIES LTD |
发明人 |
TU MYEONG-DEOK;YEH YAO-TING |
分类号 |
H01L31/12;F21V5/00;F21V19/00 |
主分类号 |
H01L31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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