| 摘要 |
<p>The present invention relates to a plating method and a plating apparatus, the plating method comprising the steps of: inserting objects to be plated in a plating bath which is filled with a plating solution such that the objects to be plated are randomly inserted above a nozzle unit of the plating bath; and operating a pump so as to inject the plating solution upwards through injection nozzles of the nozzle unit at the inner bottom of the plating bath such that as the plating solution is injected continuously and with high pressure, the objects to be plated float above the nozzle unit and freely move, and plating is performed in a state where the objects to be plated are floating. Accordingly, the present invention carries out the plating in a state where the objects to be plated are freely floating by injecting the plating solution with high pressure from the lower part of the plating bath, that is, in a state where the objects to be plated float in the plating solution without coming into contact with each other. Therefore, the present invention can uniformly form a plating film over the whole surface of the objects to be plated, and can be helpfully used to obtain a plated object having high quality.</p> |
