| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection method, a substrate manufacturing method, and a substrate inspection device, capable of quickly, highly accurately, easily, and clearly performing defect inspection of each hole even when the total number of holes is increased due to hole diameter miniaturization and substrate upsizing and the like in a substrate in which a plurality of holes are formed.SOLUTION: A substrate inspection method for inspecting a substrate in which a plurality of holes are formed in a plate-like material comprises: a step S103 of acquiring an image of each hole by picking up the plurality of holes formed on the substrate from one surface side of the substrate (image acquisition step); a step S105 of specifying a reference hole about the plurality of holes (reference specification step); steps 105 to 107 of calculating similarity between the reference hole image and each hole image by pattern matching processing and quantifying the similarity (quantification step); and step S108 of determining whether a hole shape of each of the plurality of holes is acceptable or not acceptable using the quantification results of each hole image as an index (shape inspection step). |
