发明名称 |
SEMICONDUCTOR COMPONENT WITH A WINDOW OPENING AS AN INERFACE FOR AMBIENT COUPLING |
摘要 |
A window opening in a semiconductor component is produced on the basis of a gate structure which serves as an efficient etch resist layer in order to reliably etch an insulation layer stack without exposing the photosensitive semiconductor area. The polysilicon in the gate structure is then removed on the basis of an established gate etching process, with the gate insulation layer preserving the integrity of the photosensitive semiconductor material. |
申请公布号 |
US2015035027(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
US201414518330 |
申请日期 |
2014.10.20 |
申请人 |
X-FAB SEMICONDUCTOR FOUNDRIES AG |
发明人 |
EINBRODT Wolfgang;GAEBLER Daniel |
分类号 |
H01L31/0232;H01L31/028;H01L31/0224;H01L31/113;H01L31/02 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Erfurt GE |