DEVICES AND METHODOLOGIES TO CLEAN WAFERS WITH SOLVENT

摘要

Disclosed are devices and methodologies for cleaning wafers in wafer processing operations such as solvent cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and solvent cleaning operations are disclosed.

主权项

1. A method for cleaning a wafer, the method comprising:
providing a wafer-holder including a plate having a top side including a surface and a bottom side, and a plurality of features formed on the surface of the plate and distributed substantially uniformly across the surface, the top side dimensioned such that the wafer positioned on the top side is offset from the surface by a height defined by the plurality of features; placing a wafer to be cleaned on the top side of the wafer-holder; positioning the wafer-holder with the wafer thereon so that the wafer-holder is held at an angle away from vertical; applying a cleaning solution to the wafer held at the angle, the plurality of features on the surface of the plate being dimensioned and distributed to allow efficient movement of the cleaning solution relative to the wafer; and draining the cleaning solution from the wafer, the wafer being held at the angle facilitating the draining to promote drainage of the cleaning fluid.