HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEALED CHASSIS WALL
摘要
Provided is a system for cooling electronic components. The system includes tubing having a central portion attachable to a heat source disposed within a sealed enclosure. Distal portions of the tubing extend outside the enclosure through walls thereof. The system also includes fins attachable to the distal portions.
申请公布号
WO2015016808(A1)
申请公布日期
2015.02.05
申请号
WO2013US52488
申请日期
2013.07.29
申请人
GE INTELLIGENT PLATFORMS, INC.
发明人
DE BOCK, HENDRIK PIETER JACOBUS;CHAMARTHY, PRAMOD;CHAUHAN, SHAKTI, SINGH;DENG, TAO;HODEN, BRIAN;WEAVER, STANTON, EARL