DRESSING METHOD AND DRESSING DEVICE

摘要

The present invention is a dressing method for dressing a polishing pad, which polishes a wafer that is affixed on a surface plate, by pressing and sliding brushes and plates on the polishing pad, the dressing method being characterized in that the polishing pad is dressed by pressing and sliding the brush tips and plates simultaneously on the polishing pad after protruding the brush tips past the dressing surfaces of the plates that slidingly contact the polishing pad. As a result, a dressing method and a dressing device, which are able to limit the generation of particles and improve polishing pad life by roughening the polishing surface of the polishing pad to an appropriate degree while limiting abrasion of the polishing pad, are provided.