| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve thermal peeling resistance of Sn plating formed on a Cu-Ni-Si-based alloy plate containing Zn.SOLUTION: There is provided the Cu-Ni-Si-based copper alloy plate which contains Ni:1.0 to 4.0 mass%, Si:0.2 to 0.9 mass% and Zn:0.7 to 2.0 mass% and the balance Cu with inevitable impurities and which has been subjected to a solution heat-treatment accompanied by recrystallization and an aging treatment. In the Cu-Ni-Si-based copper alloy plate, the concentration of the metal Zn when the plate is sputtered until 0.2μm depth from the surface, is set to be 0.7 mass% or more by an Auger electron spectroscopy. The concentration of the metal Zn can be 0.7 mass% or more by using N-Hgas as an atmosphere gas for the solution heat- treatment or removing a surface layer by etching or polishing after the solution heat-treatment.</p> |
