| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board manufacturing method which can prevent deterioration of electrical characteristics such as conductivity which occurs when an interlayer conductive part is formed.SOLUTION: A manufacturing method of a circuit board 1 having an interlayer conductive part 12 comprises: a process of forming recesses 21 on one principal surface of an insulating substrate 2 by an imprint method so as to follow a shape of the interlayer conductive part 12 and leave a thin film part 14 of the insulating substrate 2 at a bottom; a process of forming a modified layer 22 which pierces the thin film part 14 from a top face to an undersurface; a process of providing metal plating catalyst to the modified layer 22; a process of forming a metal layer 4 by electroless plating on the modified layer 23 to which the metal plating catalyst is provided; and a process of filing the recesses 21 with conductors 6 by electrolytic plating using the metal layer 4 as a seed layer.</p> |
