发明名称 MULTI-PIECE WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which makes division along borders of wiring board regions easy.SOLUTION: A multi-piece wiring board including a mother board 1 which is composed of a ceramic sintered body and has a top face and an undersurface and on which a plurality of wiring board regions 2 are arranged in a matrix comprises: recesses 2a which are provided on the top face of the mother board 1 and each of which is located at a central part of each wiring board region 2; a plurality of holes 3 aligned on the top face of the mother board 1 and along borders of the wiring board regions 2; and split grooves 4 provided on the undersurface of the mother board 1 and along the borders of the wiring substrate regions 2. Each breaking direction of the mother board from a bottom of the split groove 4 is guided by a direction of the holes 3 thereby to make division of the mother board 1 along the borders of the wiring board regions 2 easy.</p>
申请公布号 JP2015026685(A) 申请公布日期 2015.02.05
申请号 JP20130154677 申请日期 2013.07.25
申请人 KYOCERA CORP 发明人 TOJO TETSUYA
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
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