| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board including a thick conductive part having excellent adhesion to a substrate, and excellent in conduction between laminated conductive parts.SOLUTION: A method for manufacturing a multilayer wiring board comprises at least the steps of: forming a first coating layer on a substrate; forming a first conductive part by irradiating at least a partial region of the first coating layer with first light; forming a second coating layer on the first coating layer; and forming a second conductive part containing metal and conductively connected to the first conductive part by irradiating at least a part of the first conductive part with second light from an upper surface of the second coating layer. Thickness of the coating layer and an absorption coefficient of the coating layer to the light with which the coating layer is irradiated meet a prescribed relationship.</p> |
