CONDUCTIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive conductive resin composition excellent in conductivity, adhesive property and workability.SOLUTION: The conductive resin composition contains (A) a silver coated silica particle, (B) an epoxy resin and (C) a curing agent as essential components. The (A) silver coated silica particle is contained at 35 to 90 mass% in the conductive resin composition. Also the (A) silver coated silica particle is a spherical particle having an aspect ratio of 1.0 to 1.2, a specific surface area by a gas absorption method of 0.3 to 5.0 m/g, an accumulated volume particle diameter by a laser diffraction scattering type particle size distribution measurement, Dof 1 to 10μm, and a value of D/Drepresented by accumulated volume particle diameters Dand Dof 1.0 to 5.0 and a maximum particle diameter of 40μm or less.