WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD

摘要

A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).

主权项

1. A wiring board, comprising:
an inorganic insulating layer; a first resin layer on one main surface of the inorganic insulating layer; a second resin layer on another main surface of the inorganic insulating layer; and a conductive layer partially on one main surface of the second resin layer, the one main surface being on an opposite side to the inorganic insulating layer, wherein the inorganic insulating layer comprises a plurality of first inorganic insulating particles which are bound to each other at a part of each of the first inorganic insulating particles, and gaps which are surrounded by the plurality of first inorganic insulating particles, and a part of the first resin layer and a part of the second resin layer are located inside the gaps.