发明名称 |
Multilayered Ceramic Capacitor with Improved Lead Frame Attachment |
摘要 |
A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat. |
申请公布号 |
US2015036263(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
US201414498514 |
申请日期 |
2014.09.26 |
申请人 |
Kemet Electronics Corporation |
发明人 |
Hill R. Allen;Lessner Philip M.;Phillips Reggie;Brown Keith;Byrd James B. |
分类号 |
H01G2/06;H01G4/008;H01G4/30 |
主分类号 |
H01G2/06 |
代理机构 |
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代理人 |
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主权项 |
1. A capacitor comprising:
parallel conductive internal electrodes of alternating polarity with a dielectric between said conductive internal electrodes; a first copper undercoat in electrical contact with conductive internal electrodes of a first polarity; a second copper undercoat in electrical contact with conductive internal electrodes of a second polarity; a first lead in electrical contact with said first copper undercoat with a first solder between said first lead and said first copper undercoat; a second lead in electrical contact with said second copper undercoat with a second solder between said second lead and said second copper undercoat; a solderable silver layer between said first copper undercoat and said first lead; and a flexible layer between said solderable silver layer and said first copper undercoat. |
地址 |
Simpsonville SC US |