发明名称 Multilayered Ceramic Capacitor with Improved Lead Frame Attachment
摘要 A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
申请公布号 US2015036263(A1) 申请公布日期 2015.02.05
申请号 US201414498514 申请日期 2014.09.26
申请人 Kemet Electronics Corporation 发明人 Hill R. Allen;Lessner Philip M.;Phillips Reggie;Brown Keith;Byrd James B.
分类号 H01G2/06;H01G4/008;H01G4/30 主分类号 H01G2/06
代理机构 代理人
主权项 1. A capacitor comprising: parallel conductive internal electrodes of alternating polarity with a dielectric between said conductive internal electrodes; a first copper undercoat in electrical contact with conductive internal electrodes of a first polarity; a second copper undercoat in electrical contact with conductive internal electrodes of a second polarity; a first lead in electrical contact with said first copper undercoat with a first solder between said first lead and said first copper undercoat; a second lead in electrical contact with said second copper undercoat with a second solder between said second lead and said second copper undercoat; a solderable silver layer between said first copper undercoat and said first lead; and a flexible layer between said solderable silver layer and said first copper undercoat.
地址 Simpsonville SC US