| 摘要 |
This electronic device manufacturing method has a step for obtaining an electronic device by separating a silicone resin layer-laminated supporting base material and the electronic device from an electronic device member-laminated laminated body by having, as a peeling surface, an interface between a silicone resin layer and a glass substrate, said electronic device member-laminated laminated body having a supporting base material, the silicone resin layer, the glass substrate, and an electronic device member laminated therein in this order. In the electronic device manufacturing method, the silicone resin-laminated supporting base material and the electronic device are separated from each other by supplying an organic solvent having a solubility parameter of more than 10 or a mixed solution of the organic solvent and water to a peeling line, i.e., a boundary line, on the peeling interface between the silicone resin layer and the glass substrate. |
