| 摘要 |
<p>The present invention relates to a device for cutting an ingot and, more specifically, comprising: multiple wires which are arranged at regular intervals; more than two rollers for rotating the multiple wires toward one direction or the other direction in order to cut the ingot; a driving unit for rotating the rollers toward one direction or the other direction; a lifting unit which is equipped in the upper part of the arranged multiple wires, for fixating the ingot, which is a target for cutting, and for moving the ingot up and down; a cutting fluid feeding unit for spraying a cutting fluid toward the multiple wires, which are rotated in order to cut the ingot, since a plurality of first cutting nozzles and second cutting nozzles are arranged toward a direction of being crossed with the arranged multiple wires, while a plurality of the first cutting nozzles are equipped in one side and a plurality of the second cutting nozzles are equipped in the other side based on the lifting unit; and a cleaning fluid feeding unit for spraying a cleaning fluid toward the multiple wires, which are rotated after a plurality of first cleaning nozzles and second cleaning nozzles are arranged toward a direction of being crossed with the arranged multiple wires, and cut the ingot, while a plurality of the first cleaning nozzles are equipped in one side and a plurality of the second cleaning nozzles are equipped in the other side based on the lifting unit.</p> |
