发明名称 METHOD AND APPARATUS FOR FORMING THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a thin film capable of covering the whole area of a region to be applied on a substrate surface with a thin film material even if the substrate surface has liquid repellency.SOLUTION: A first film is formed in a region where a thin film material is to be applied on a surface having liquid repellency, by repeating a process of impacting a photocurable thin film material on the surface and a process of curing the thin film material on the surface after impacting by irradiating the thin film material with light, while moving an impact point. A second film in a liquid state is formed by applying a liquid thin film material on the first film. After the second film is formed, the second film is cured by irradiating the second film with light.
申请公布号 JP2015026655(A) 申请公布日期 2015.02.05
申请号 JP20130154082 申请日期 2013.07.25
申请人 SUMITOMO HEAVY IND LTD 发明人 OKAMOTO YUJI
分类号 H01L21/52;H05K3/34 主分类号 H01L21/52
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