| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which makes a load applied to a lead less likely to be transmitted to a ceramic substrate and prevents damage of the ceramic substrate even if the load is applied to the lead, and to provide a lead frame.SOLUTION: A semiconductor device includes: a ceramic substrate 2; a semiconductor chip mounted on the ceramic substrate 2; a conductive lead 5 which is formed into a strip shape, the lead 5 having one longitudinal end part joined to a wiring pattern 2A formed on the ceramic substrate; and a mold resin 6 which seals the ceramic substrate 2, the semiconductor chip, and the one end side of the lead 5. Bent parts 53, 54 having bent shapes are formed at an inner lead part 51 of the lead 5 which is sealed by the mold resin 6. |
