| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves high flexibility for the reduction of the size and the film thickness of the device and the mounting to a circuit board while maintaining high heat radiation performance.SOLUTION: A semiconductor device of the invention includes: a semiconductor element; and a package 10 where the semiconductor element is disposed. The package 10 has a heat conductive member 12 below conductor wiring connecting with the semiconductor element, and the heat conductive member 12 is disposed below the semiconductor element and is buried inside an insulation member for forming the package 10. |
