| 发明名称 |
NANO-GRAINED MULTILAYER COPPER ALLOY SHEET HAVING HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY, AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
In a high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, a plurality of high strength and high electrical conductive nano crystalline grain multi-layer sheets manufactured by roll-bonding an oxygen free copper (OFC) alloy sheet and a deoxidized low-phosphorous copper (DLP) alloy sheet are plastically bonded by roll-bonding method so that an OFC alloy layer and a DLP alloy layer are alternated to each other to have electrical conductivity of 85 IACS (%) or more and tensile strength of 500 MPa or more. |
| 申请公布号 |
US2015037609(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201113979467 |
申请日期 |
2011.12.26 |
| 申请人 |
Kim Hyoung Wook;Lim Cha Yong |
发明人 |
Kim Hyoung Wook;Lim Cha Yong |
| 分类号 |
B23K20/04;B32B15/01;B32B15/20;B23K20/24;B23K20/233 |
主分类号 |
B23K20/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, comprising:
an oxygen free copper (OFC) alloy and a deoxidized low-phosphorous copper (DLP) alloy that are repeatedly roll-bonded to have electrical conductivity of 85 IACS (%) or more and tensile strength of 500 MPa or more. |
| 地址 |
Changwon-si KR |
