ARTICLES INCLUDING METAL STRUCTURES HAVING MAXIMIZED BOND ADHESION AND BOND RELIABILITY, AND METHODS OF FORMING THE SAME

摘要

Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

主权项

1. A method of effecting bond adhesion between metal structures, the method comprising:
forming a first metal structure on a substrate, wherein the first metal structure comprises grains having a {111} crystallographic orientation and wherein the first metal structure comprises an exposed contact surface; inducing formation of an uneven surface topology in the exposed contact surface of the first metal structure after forming the first metal structure; bonding a second metal structure to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.