METHOD OF REDUCING THE THICKNESS OF A SAPPHIRE LAYER

摘要

A method of removing material from a sapphire article is described. In particular, the method comprises the step of providing an initial sapphire layer and reducing the thickness of the layer while not significantly increasing the surface roughness of the layer. Cover plates for electronic device and methods of preparing them are also disclosed, along with a method of analyzing a sapphire article produced by the present method.

主权项

1. A method of producing a sapphire layer comprising the steps of:
i) providing an initial sapphire layer having a thickness and at least one surface, the surface of the initial sapphire layer having an average surface roughness value of RaI; and ii) reducing the thickness of the initial sapphire layer by contacting the surface with a reagent solution to produce the sapphire layer, wherein the sapphire layer has a thickness that is less than the thickness of the initial sapphire layer and further has a final surface having an average surface roughness value of RaF, wherein (RaF−RaI)/RaI is less than or equal to 0.2.