RDL SYSTEM IN PACKAGE

摘要

A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

主权项

1. An electronic module, comprising:
a substrate having a component area on a surface of the substrate, wherein the component area includes a first conductive pad; an electronic component on the component area, wherein the electronic component includes a second conductive pad; a first insulating layer formed over the component area, wherein at least a first section of the first conductive pad and at least a second section of the second conductive pad are uncovered by the first insulating layer; a conductive layer formed over the first insulating layer and being attached to at least the first section of the first conductive pad and at least to the second section of the second conductive pad such that the conductive layer electrically couples the first conductive pad to the second conductive pad; a second insulating layer formed over the component area that at least covers the conductive layer; and an electromagnetic shield formed over the first insulating layer and the second insulating layer.