发明名称 DEVELOPING METHOD, DEVELOPING APPARATUS AND STORAGE MEDIUM
摘要 A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.
申请公布号 US2015036109(A1) 申请公布日期 2015.02.05
申请号 US201414449419 申请日期 2014.08.01
申请人 TOKYO ELECTRON LIMITED 发明人 YOSHIHARA Kousuke;KYOUDA Hideharu;MUTA Koshi;YAMAMOTO Taro;TAKIGUCHI Yasushi;FUKUDA Masahiro
分类号 G03F7/30 主分类号 G03F7/30
代理机构 代理人
主权项 1. A developing method comprising: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate.
地址 Tokyo JP