发明名称 MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR BUNDLE PRODUCT
摘要 Provided is a manufacturing method for a bundle product that includes an inspecting step of inspecting two or more threads continuously running in parallel in the longitudinal direction, a collecting step of collecting the threads, and a cutting step of cutting, after completion of the collecting, all the collected threads at a predetermined position, to obtain a bundle product having plural threads converged into a bundle. In the manufacturing method, an amount of collection in the collecting step is adjusted on the basis of inspection results obtained in the inspecting step so that at least one managed quantity for plural threads selected from a group including a total number, a total weight, a representative weight, a total outside diameter value, a representative outside diameter value, a total surface area, and a representative surface area of the plural threads constituting the bundle product exceeds a predetermined value.
申请公布号 US2015034755(A1) 申请公布日期 2015.02.05
申请号 US201314380258 申请日期 2013.01.29
申请人 TORAY INDUSTRIES, INC. 发明人 Kuramata Osamu;Uchino Makoto;Nishioka Daikichi;Minaki Nao
分类号 B65H54/58;B65H63/06 主分类号 B65H54/58
代理机构 代理人
主权项 1. A manufacturing method for a bundle product, comprising the steps of: inspecting two or more threads continuously running in parallel in a longitudinal direction; collecting the threads; and cutting, after completion of the collecting, all the collected threads at a predetermined position, to obtain a bundle product having a plurality of threads converged into a bundle, wherein an amount of collection in the collecting step is adjusted on the basis of inspection results obtained in the inspecting step so that at least one managed quantity for a plurality of threads selected from a group including a total number, a total weight, a representative weight, a total outside diameter value, a representative outside diameter value, a total surface area, and a representative surface area of the plurality of threads constituting the bundle product exceeds a predetermined value.
地址 TOKYO JP