发明名称 |
METHOD OF ANALYZING PLATING SOLUTION AND METHOD OF PRODUCING METALLIC BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of analyzing a plating solution which is used to detect a change of the dissolve oxygen content of a plating solution for deposition of a metal lower in standard electrode potential than water.SOLUTION: A method of analyzing a plating solution includes a step of applying a negative potential, relative to the standard electrode potential of an object metal, to an electrode in a plating solution consisting of a nonaqueous electrolyte to cause the object metal to be deposited on the surface of the electrode and a step of applying a positive potential, relative to the standard electrode potential of the object metal, to the electrode for a time longer than the time for application of the negative potential to dissolve the object metal on the surface of the electrode, and a dissolved oxygen content in the plating solution is calculated on the basis of a ratio of the dissolved amount to the deposition amount of the object metal. |
申请公布号 |
JP2015025154(A) |
申请公布日期 |
2015.02.05 |
申请号 |
JP20130154284 |
申请日期 |
2013.07.25 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SUGIHARA TAKAYASU;GOTO KENGO;TSUCHIKO SATORU;KASUYA KOJI;UMEMOTO TOKIKO;HOSOE AKIHISA;NISHIMURA JUNICHI;OKUNO KAZUKI;KIMURA KOTARO;SAKAIDA HIDEAKI |
分类号 |
C25D21/12;C25D3/66;G01N31/00 |
主分类号 |
C25D21/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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