| 摘要 |
PROBLEM TO BE SOLVED: To enhance smoothness of flow of plasma generating gas around the outer peripheral edge of a board.SOLUTION: A dry etching device 1 has a feeding carrier 5 comprising a holding sheet 6 for holding a wafer and a frame 7, and an upward and downward movable cover 33. The cover 33 is movable to a descending position at which the cover 33 covers the feeding carrier 5 mounted on a stage 14. At the descending position, a contact surface face 33f at the tip of a cover side projecting portion 33g provided to an outer peripheral portion 22B of a main body 33a of the cover 33 come into planar contact with a contact face 14a provided to an exterior part 22B of the stage 14. A through-hole 37 is provided to the cover side projecting portion 33g. The frame 7 is located in a space 36 surrounded by the lower surface side of the cover 33. Plasma generating gas flowing into the space 36 flows out from the space 36 through the through-hole 37. |
