PHOTOSENSITIVE-RESIN COMPOSITION

摘要

[Problem] To provide the following: a photosensitive-resin composition that can form patterns that exhibit excellent resolution and resist feature size and can also form patterns that, in addition to doing well when subjected to a pressure-cooker test (i.e. doing well at withstanding a combination of heat and humidity), withstanding reflow well, excelling in terms of electrical-insulation performance (doing well when subjected to a highly accelerated stress test), and withstanding electroless plating well, exhibit excellent adhesion and resistance to heat, solvents, and chemicals (alkalinity and acidity); a permanent mask resist using said photosensitive-resin composition; and a printed circuit board provided with said permanent mask resist. [Solution] A photosensitive-resin composition containing an acid-modified-vinyl-group-containing epoxy resin (A), a photopolymerization initiator (B), a nitrogen-containing heterocyclic compound (C), and a photopolymerizable compound (D), the mean particle diameter of the nitrogen-containing heterocyclic compound (C) being between 0.01 and 10 µm, inclusive; a permanent mask resist using said photosensitive-resin composition; and a printed circuit board.