INDUCTIVE DEVICE THAT INCLUDES CONDUCTIVE VIA AND METAL LAYER
摘要
<p>An inductive device that includes a conductive via and a metal layer are disclosed. A particular method of forming an electronic device includes forming a metal layer that contacts a surface of a substrate. The substrate, including the surface, is formed from a substantially uniform dielectric material. The metal layer contacts a conductive via that extends at least partially within the substrate. The metal layer and the conductive via form at least a portion of an inductive device.</p>
申请公布号
WO2015017153(A1)
申请公布日期
2015.02.05
申请号
WO2014US47423
申请日期
2014.07.21
申请人
QUALCOMM INCORPORATED
发明人
LAN, JE-HSIUNG;ZUO, CHENGJIE;VELEZ, MARIO FRANCISCO;KIM, DAEIK D.;BERDY, DAVID F.;YUN, CHANGHAN;MIKULKA, ROBERT P.;KIM, JONGHAE;NOWAK, MATTHEW M.