| 发明名称 |
Segmented Bond Pads and Methods of Fabrication Thereof |
| 摘要 |
In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first bond pad includes a first plurality of pad segments. At least one pad segment of the first plurality of pad segments is electrically isolated from the remaining pad segments of the first plurality of pad segments. |
| 申请公布号 |
US2015035171(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201313958276 |
申请日期 |
2013.08.02 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Birner Albert;Brech Helmut;Zigldrum Matthias |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a first bond pad disposed at a first side of a substrate, the first bond pad comprising a first plurality of pad segments, wherein at least one pad segment of the first plurality of pad segments is electrically isolated from the remaining pad segments of the first plurality of pad segments. |
| 地址 |
Neubiberg DE |
