SEGMENTED GUARD RING STRUCTURES WITH ELECTRICALLY INSULATED GAP STRUCTURES AND DESIGN STRUCTURES THEREOF

摘要

Disclosed are guard ring structures with an electrically insulated gap in a substrate to reduce or eliminate device coupling of integrated circuit chips, methods of manufacture and design structures. The method includes forming a guard ring structure comprising a plurality of metal layers within dielectric layers. The method further includes forming diffusion regions to electrically insulate a gap in a substrate formed by segmented portions of the guard ring structure.

主权项

1. A structure comprising:
a discontinuous guard ring structure in dielectric layers comprising a plurality of metal layers surrounding an active area of a chip; a gap in an underlying substrate formed between segments of the discontinuous guard ring structure; and an electrically insulating structure within the gap to reduce or eliminate device coupling of integrated circuit chips.