| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection method, a substrate manufacturing method, and a substrate inspection device, capable of quickly, highly accurately, and easily performing defect inspection of each hole in a cheap configuration even when the total number of holes is increased due to hole diameter miniaturization and substrate upsizing and the like in a substrate in which a plurality of holes are formed.SOLUTION: A substrate inspection method for inspecting a substrate in which a plurality of holes are formed in a plate-like material comprises: a step S103 of picking up an image of the hole formed on the substrate from one surface side of the substrate via an optical system including a microscope with an object lens having a predetermined magnification (image acquisition step); a step S104 of acquiring a super-resolution image equivalent to the image picked up via an optical system including a microscope with an object lens having a higher magnification than the predetermined magnification by performing super-resolution image processing for the image acquired by the image acquisition step (S103) (super-resolution image processing step); and a step S108 of inspecting whether the hole formed in the substrate is acceptable or not acceptable using the super-resolution image acquired by the super-resolution image processing step (S104) (inspection step). |
