发明名称 VERTICAL MICROCOAXIAL INTERCONNECTS
摘要 In one embodiment, a vertical microcoaxial interconnect includes a dielectric substrate having a top side and a bottom side, an inner conductor extending through the substrate from its top side to its bottom side, an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor surrounding the inner conductor, a signal line extending to the inner conductor without contacting the outer conductor, and a ground line extending to the outer conductor without contacting the inner conductor or the signal line.
申请公布号 US2015035615(A1) 申请公布日期 2015.02.05
申请号 US201314047191 申请日期 2013.10.07
申请人 Boone Justin;Krishnan Subramanian;Bhansali Shekhar 发明人 Boone Justin;Krishnan Subramanian;Bhansali Shekhar
分类号 H01P5/02 主分类号 H01P5/02
代理机构 代理人
主权项 1. A vertical microcoaxial interconnect comprising: a dielectric substrate having a top side and a bottom side; an inner conductor extending through the substrate from its top side to its bottom side; an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor comprising first and second generally C-shaped lateral portions whose ends are separated by opposed gaps and that concentrically encircle the inner connector; a signal line extending to the inner conductor without contacting the outer conductor; and a ground line extending to the outer conductor without contacting the inner conductor or the signal line.
地址 Lutz FL US