METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board capable of more easily manufacturing a multilayer wiring board including a conductive part with excellent adhesion, and a conductively connected region and an insulated region between laminated conductive parts.SOLUTION: A method for manufacturing a multilayer wiring board comprises at least the steps of: forming a first coating layer on a substrate; forming a first conductive part by irradiating at least a partial region of the first coating layer with first light; forming a second coating layer on the first coating layer; forming a second conductive part and a third conductive part by irradiating at least a part of the first conductive part with second light from an upper surface of the second coating layer and irradiating a region different from the region irradiated with the second light from the upper surface of the second coating layer with third light; forming a third coating layer on the second coating layer; and forming a fourth conductive part and a fifth conductive part by irradiating at least a part of the second conductive part and at least a part of the third conductive part with fourth light from an upper surface of the third coating layer.