| 摘要 |
This sputtering apparatus is provided with: an electrode (310), which has a holding section (311) that holds a target (50), and which applies a potential to the target (50) via the holding section (311); a first magnet (331) and a second magnet (332), which are disposed by being spaced apart from each other in the direction along a substrate disposing surface (SS), on which a substrate is to be placed, such that a space (SP) between the substrate disposing surface (SS) and the holding section (311) is sandwiched between the magnets; and a shield (340) that is disposed at a position, which is between the first magnet (331) and the second magnet (332), and also between the substrate disposing surface (SS) and the holding section (311). |
