发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR |
摘要 |
<p>According to one embodiment of the present invention, a flexible printed circuit board and a manufacturing method therefor are disclosed. The flexible printed circuit board can comprises: a bendable base film; a circuit wiring formed on the base film by using a conductive print ink printed by screen-printing method; an insulating layer formed on the circuit wiring by using an insulating ink printed by screen-printing method; and an adhesive layer formed in a through-hole of the insulating layer by using a conductive adhesive.</p> |
申请公布号 |
WO2015016401(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
WO2013KR06852 |
申请日期 |
2013.07.30 |
申请人 |
A RAINBOW CO., LTD. |
发明人 |
NA, JUNG SOO;KIM, YOUNG MIN |
分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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